TY  - JOUR
AU  - Pham, M.T.
AU  - Maitz, M.
AU  - Richter, E.
AU  - Reuther, H.
AU  - Prokert, F.
AU  - Mücklich, A.
PY  - 2004
TI  - Electrochemical behaviour of nickel surface-alloyed with copper and titanium
SP  - 185-93
JF  - J Electroanal Chem
VL  - 572
IS  - 1
N1  - 10.1016/j.jelechem.2004.06.011
N2  - Ni was surface-alloyed with Cu, Ti or Cu + Ti by ion implantation. This material was examined for its redox and electrocatalytic activity by cyclic voltammetry. The surface was characterized by X-ray photoelectron spectroscopy, X-ray and electron diffraction, and electron and atomic force microscopy. This type of materials exhibited a unique voltammetric response of Ni and was shown to stabilize the ß modification of the Ni oxide/hydroxide. Cu modified the anodic oxidation of glucose and the oxygen evolution to a higher degree than Ti. The morphology and microstructure differed from those of bulk materials.
UR  - http://dx.doi.org/10.1016/j.jelechem.2004.06.011
ER  -